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Communication Manager Maintenance-Object Repair Procedures
2242 Maintenance Procedures for Avaya Communication Manager 3.0, Media Gateways and Servers
5. If the TDM-bus fault is still present, the suspected circuit pack was not the cause of the
TDM-bus failure. Do the following:
a. Remove the replacement circuit pack that was just inserted and replace it with the
previously suspected circuit pack.
b. Repeat Procedure 3 for the next circuit pack on the list for this procedure.
If none of the TDM-bus tests fail, the procedure is completed.
If Procedure 3 fails to identify the cause of the problem, go to Procedure 4: Isolating TDM-Bus
Failures to Carriers on page 2244.
S8700 MC
Procedure for PN with Duplicated PNC
In this type of configuration, the test procedure is made up of several independent parts. In a
duplicated system, it is desirable to investigate whether circuit packs are causing TDM-bus
problems when they are in active mode, in standby mode, or both. The procedure utilizes a
PNC interchange in a PN. If the TDM-bus fault disappears after an interchange takes place, the
newly standby Expansion Interface (PN), is suspect and should be replaced. If the problem still
exists, the Tone-Clocks are then interchanged. If the TDM-bus failure then disappears, the
newly standby Tone-Clock is suspect and should be replaced. If the TDM-bus problem still
exists, then the procedure begins diagnostics on individual circuit packs and backplane pins.
Part 1 (PN Procedure)
1. Execute status pnc to determine which PNC is currently active.
2. Run reset pnc interchange to make the currently active PNC standby.
3. Run test tdm P to determine whether the TDM-bus fault is still present.
If the TDM-bus fault is gone, replace the formerly active Expansion Interface circuit pack.
4. Run reset pnc interchange again to activate the PNC where the new Expansion
Interface circuit pack resides.
5. Run test tdm P to determine whether the TDM-bus fault is still present.
If the TDM-bus fault is gone, the procedure is finished.
If not, replace the new Expansion Interface circuit pack with the originally suspected circuit
pack, and continue with Part 2.