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Communication Manager Maintenance-Object Repair Procedures
2240 Maintenance Procedures for Avaya Communication Manager 3.0, Media Gateways and Servers
In Procedure 2, an option of working either with one circuit pack at a time or with multiple circuit
packs simultaneously is available. In view of this capability, determine the level of service
interruption that will be acceptable during the procedure. If causing a disruption to all users in
the port network is deemed permissible, large groups of circuit packs should be worked with in
order to get the job done quickly. However, if large service disruptions are to be avoided, work
with one circuit pack at a time. This option is slower, but it disrupts only the users of a single
circuit pack.
1. Remove one or several circuit packs as appropriate. Any circuit packs that reside on the
TDM bus that were recently inserted should be checked first.
Remove port circuit packs which have failed the NPE Crosstalk Test (#6) first. To find which
circuit packs failed this test, display the Hardware Error Log via the display errors
command. Refer to the Maintenance documentation of each port circuit pack that has port
errors to check if any error indicates the failure of the NPE Crosstalk Test. If no circuit pack
failed the NPE Crosstalk Test (#6), remove one or several purple slot circuit packs.
If you decide to remove multiple circuit packs, consider working with an entire carrier at a
time to more quickly and reliably determine which circuit packs are not the source of trouble.
2. Run test tdm P to determine if the TDM-bus fault is still present.
3. If any of the TDM-bus tests fail:
● Determine whether the backplane pins in the removed circuit pack’s slot appear to be
bent.
● If the backplane pins are not bent, reinsert the circuit pack(s), and perform Procedure 2
for the next set of circuit packs.
● If the backplane pins are bent, remove power to this carrier in the manner described
previously.
● Straighten or replace the pins and reinsert the circuit pack.
● Restore power and repeat Procedure 2, beginning with Step 2, for the same circuit
pack(s).
4. If none of the TDM-bus tests fail:
● Reinsert the circuit pack(s) one at a time, and repeat the following substeps until every
circuit pack has been reinserted.
● Run test tdm P to determine if the TDM-bus fault has returned.
● If any of the TDM-bus tests fail, the reinserted circuit pack is defective. Replace this
circuit pack and repeat this procedure for the next circuit pack.
● If none of the TDM-bus tests fail when every circuit pack has been reinserted, the
problem has been fixed and the procedure is completed.
Continue with Procedure 3 if every port circuit pack has been checked, but the TDM-bus fault is
still not resolved.