Seiko Instruments MT-17E-003-D Heat Pump User Manual


 
STP-H600/H1000 Series Instruction Manual
7.3 Baking the STP Pump
To attain a lower pressure in a shorter time and reduce the exhaust time, bake the vacuum
equipment and STP pump.
WARNIN
G
The surfaces of the STP pump and its peripheral equipment will become
extremely hot when performing baking. NEVER touch them with bare hands.
C
A
U
TI
O
N
When baking the STP pump, always cool it to prevent overheating (for the
cooling method, see Section 7.2, "Cooling the STP Pump").
Start baking after cooling is started.
Set the temperature of the baking heater to 120 or lower (an optional baking
heater is set to 110 or lower).
DO NOT suck gases during baking to prevent overheating.
NOTICE
To exhaust the gas discharged from the vacuum equipment and the inner wall of
the STP pump, run the STP pump during baking.
7.3.1 Attaching a Baking Heater
1) Attach a baking heater (optional accessory) as near as possible to the inlet port
flange.
2) Affix the "Hot Surface Warning Label" to the surface of the STP pump so that
the operator can see it clearly at any time.
C
A
U
TI
O
N
Check the rated voltage of the baking heater before use.
Wind the baking heater around the surface of the STP pump tightly.
If the baking heater is not wound tightly, the loose parts will overheat.
Procure protective parts for the baking heater, such as a residual current
operated circuit breaker and fuses when using the baking heater (remote
terminal block TB2 incorporates fuses).
DO NOT apply excessive force to the cable for the baking heater.
7-4