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STP-H600/H1000 Series Instruction Manual
7 Gas Suction, Cooling and Baking the STP Pump
7.1 Gas Suction
WARNIN
G
When sucking gases, they may remain in the STP pump. Introduce a purge
gas and then exhaust all gasses.
Residual gases in the STP pump may cause an accident when the STP pump is
removed.
Confirm the characteristics of gases to be used, referring to the Material Safety
Data Sheet (MSDS) you obtain from the gas supplier.
C
A
U
TI
O
N
Chlorine or fluorine system gases can be used in the chemical specific STP-
H600C/H1000C (type C). When you use gases including alkaline metals, but
excluding Li, gases including Ga, Hg, In, or Sn, or HBr, contact Seiko Seiki.
NEVER use corrosive gases (chlorine, fluorine, or other system gases) in the
STP-H600/STP-H1000 pump or other models without anti-corrosion treatment.
Cool the STP pump to within the operating pressure range to prevent the STP
pump from overheating when sucking gases.
7.1.1 How to Introduce a Purge Gas
When sucking reactive or corrosive gases, introduce a purge gas to protect the
inside of the STP pump.
1) Connect a needle valve or a similar part to the purge port and introduce a dry
N
2
gas or other gas to perform a gas purge (See Section 3.3.6, "Connecting the
Purge Port").
2) The proper amount of the gas purge is approx. 3.4 10
-2
Pa·m
3
/s (20SCCM).
The allowable gas pressure ranges from zero [atmospheric pressure] to
4.9x10
4
Pa [gauge pressure] (zero [atmospheric pressure] to 0.5kgf/cm
2
[gauge
pressure]).
NOTICE
When not using the purge port, always mount the blank flange (attached at
delivery).
High-pressure at the inlet port may result in a noise. This is no
abnormality/error.
7-1