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Output Voltage Requirements
Notes:
1. Dual-Core Intel Xeon 5000 Series processors with Intel 5400 Chipsets platform has 8-layer stackup. Refer
to the latest Dual-Core Intel Xeon 5000 Series processors with Intel 5400 Chipsets Platform Design Guide
for baseboard stack-up details.
2. 9 of these HF caps are inside the processor socket cavity.
Figure 2-10. Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform VccP
Power Delivery Impedance Model Path - Example
Table 2-10. Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform Processor
Decoupling Capacitor Recommendations
Quantity Value Tolerance
Temperature
Coefficient
ESR
(mΩ)
ESL
(nH)
Notes
12 560 µF Al-Polymer ±20% Oscon 7 4 1
10 100 µF 1210 MLCC ±10% X6S 4 0.52 1
58 10 µF 1206 MLCC ±10% X5R or X6S 5 1 1, 2
Motherboard Socket & Package
Sense
Point
VR
30A to
130A
1000A/us
Low Fr Caps
12x 560µF
Oscon
Mid Fr Caps
10x 100µF
MLCC 1210
HF Caps
49x 10µF
MLCC 1206
HF Caps in
socket cavity
9x 10µF
MLCC 1206
90µF
0.56 mO
0.11 nH
20 pH
0.33 mO
54 pH
0.51 mO
490µF
0.08 mO
20 pH52 pH
0.4 mO
1mF
6.72mF
0.58 mO
0.33 nH