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Output Voltage Requirements
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Note: The amount of bulk decoupling needed is dependent on the voltage regulator design.
Some multiphase buck regulators may have a higher switching frequency that would
require a different output decoupling solution to meet the processor load line
requirements than described in this document.
Notes:
1. Only the decoupling caps inside the socket cavity need to have the temperature coefficient of “X6S”.
Notes: Dual-Core Intel Xeon 7000 Series processors with Intel 7300 Chipsets baseboard has 14-layers. Refer
to the latest Dual-Core Intel Xeon 7000 Series processors with Intel 7300 Chipsets Platform Design
Guide for baseboard stack-up details.
Table 2-7. Dual-Core Intel Xeon Processor-Based Server/Dual-Core Intel Xeon
Processor-Based Server-VS/Dual-Core Intel Xeon Processor-Based
Workstation Platform Processor Decoupling Capacitor Recommendations
6 layers, (2 power, 2 ground, 2 signal), 1 oz Cu
Quantity Value Tolerance
Temperature
Coefficient
ESR
(mΩ)
ESL
(nH)
Notes
15 560 µF Al-Polymer ±20% NA 7 4
35 10 µF 1206 Ceramic ±20% X5R or X6S 3 1.2
9 10 µF 1206 Ceramic ±20% X6S 3 1.2 1
8 layers, (3 power, 3 ground, 2 signal), 1 oz Cu
Quantity Value Tolerance
Temperature
Coefficient
ESR
(mΩ)
ESL
(nH)
Notes
13 560 µF Al-Polymer ±20% NA 7 4
35 10 µF 1206 Ceramic ±20% X5R or X6S 3 1.2
9 10 µF 1206 Ceramic ±20% X6S 3 1.2 1
8 layers, (3 power, 3 ground, 2 signal), 1 oz Cu
Quantity Value Tolerance
Temperature
Coefficient
ESR
(mΩ)
ESL
(nH)
Notes
17 560 µF Al-Polymer ±20% NA 7 4
45 10 µF 0805 Ceramic ±20% X5R or X6S 10 1.1
9 10 µF 0805 Ceramic ±20% X6S 10 1.1 1
Table 2-9. Dual-Core Intel Xeon 7000 Series with Intel 7300 Chipsets Platform Processor
Decoupling Capacitor Recommendations
Quantity Value / Description
ESR
(mΩ)
ESL
(nH)
Notes
18 560µF/2.5V/20%/ Oscon 6.3 3.2
65 22µF/6.3V/20%/ X5R /1206 MLCC 4 0.52