EM78P221/2N
8-Bit Microcontroller with OTP ROM
64 •
Product Specification (V1.0) 10.19.2007
(This specification is subject to change without further notice)
C Quality Assurance and Reliability
Test Category Test Conditions Remarks
Solderability
Solder temperature=245±5
°
C, for 5 seconds up to the
stopper using a rosin-type flux
−
Step 1: TCT, 65
°
C (15 mins)~150
°
C (15 mins), 10 cycles
Step 2: Bake at 125
°
C, TD (endurance)=24 hrs
Step 3: Soak at 30
°
C/60% , TD (endurance)=192 hrs
Pre-condition
Step 4: IR flow 3 cycles
(Pkg thickness: 2.5mm or
Pkg volume: 350mm
3
----225±5
°
C)
(Pkg thickness: 2.5mm or
Pkg volume: 350mm
3
----240±5
°
C)
For SMD IC (such as
SOP, QFP, SOJ, etc)
Temperature cycle test
-65
°
C (15 mins) ~ 150
°
C (15 mins), 200 cycles −
Pressure cooker test
TA =121
°
C, RH=100%, pressure=2 atm,
TD (endurance)= 96 hrs
−
High temperature /
High humidity test
TA=85
°
C, RH=85% , TD (endurance)=168, 500 hrs −
High-temperature
storage life
TA=150
°
C, TD (endurance)=500, 1000 hrs −
High-temperature
operating life
TA=125
°
C, VCC=Max. Operating Voltage,
TD (endurance) =168, 500, 1000 hrs
−
Latch-up
TA=25
°
C, VCC=Max. operating voltage, 150mA/20V −
ESD (HBM)
TA=25
°
C, ± 3KV
ESD (MM)
TA=25
°
C, ± 300V
IP_ND,OP_ND,IO_ND
IP_NS,OP_NS,IO_NS
IP_PD,OP_PD,IO_PD,
IP_PS,OP_PS,IO_PS,
VDD-VSS(+),VDD_VS
S (-) mode
C.1 Address Trap Detect
An address trap detect is one of the MCU embedded fail-safe functions that detects
MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an
instruction from a certain section of ROM, an internal recovery circuit is auto started. If
a noise caused address error is detected, the MCU will repeat execution of the program
until the noise is eliminated. The MCU will then continue to execute the next program.
