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ULTRAMIC™ 600 Temperature Ramping Capabilities
ULTRAMIC 600
temperature ramp
rate as a function of
watt density. Test
completed using
Watlow’s SERIES F4
temperature controller.
• Ultra-fast temperature response
• Operating temperatures up to 600°C
• Thermal uniformity
• Excellent chemical compatibility
• Geometrically stable
• High dielectric strength
• Customized design
Why ULTRAMIC 600?
Application Examples
Semiconductor Equipment
Eutectic die bonding equipment is used in the
attachment of lead wires to the die before packaging
of the IC. Optimum bonding is achieved by ramping
the solder and lead temperature through the eutectic
state. Watlow’s ULTRAMIC 600 heater is ideal for this
application because a temperature ramp of up to
150°C/second can be achieved while also achieving a
fast cool down in preparation for processing the next
device.
• Temperature ramp rate to 150°C (270°F)/sec
• Vacuum holes and grooves
• Surface flatness 0.05 mm (0.002 in.)
• Surface finish <0.8 µm
(32 µ-in.)
Analytical Instrumentation
Mass spectrometers are used to determine the
presence of trace chemicals in industrial,
environmental and clinical applications. With detection
capabilities into the part-per-trillion levels, cleanliness
is of paramount concern. For use with ion sources,
the chemical compatibility, low porosity and fine
surface finish make the ULTRAMIC 600 an excellent
choice where contamination of the sample is of
concern.
• Process temperatures to 600°C (1112˚F)
• Chemical compatibility
• High dielectric strength
• Small size and light weight