Table of Contents
About This Document.......................................................................................................13
Intended Audience................................................................................................................................13
Document Organization.......................................................................................................................13
Typographic Conventions.....................................................................................................................13
Related Information..............................................................................................................................14
Publishing History................................................................................................................................14
HP Encourages Your Comments..........................................................................................................15
1 Overview.......................................................................................................................17
Server History and Specifications.........................................................................................................17
Server Components...............................................................................................................................18
Power Subsystem..................................................................................................................................19
AC Power.........................................................................................................................................20
DC Power.........................................................................................................................................20
Power Sequencing............................................................................................................................21
Enabling 48 Volts.............................................................................................................................21
Cooling System.....................................................................................................................................21
Utilities Subsystem................................................................................................................................22
Platform Management.....................................................................................................................22
UGUY..............................................................................................................................................23
CLU Functionality...........................................................................................................................23
PM3 Functionality...........................................................................................................................23
System Clocks..................................................................................................................................24
Management Processor....................................................................................................................24
Compact Flash.................................................................................................................................25
HUCB...............................................................................................................................................25
Backplane..............................................................................................................................................26
Crossbar Chip..................................................................................................................................26
Switch Fabrics..................................................................................................................................27
Backplane Monitor and Control......................................................................................................27
I2C Bus Distribution........................................................................................................................27
Clock Subsystem..............................................................................................................................27
System Clock Distribution.........................................................................................................27
Hot-Swap Oscillator...................................................................................................................28
sx2000 RCS Module....................................................................................................................28
Cabinet ID........................................................................................................................................29
Cell ID..............................................................................................................................................29
Backplane Power Requirements and Power Distribution...............................................................29
CPUs and Memories.............................................................................................................................30
Cell Controller.................................................................................................................................31
Processor Interface...........................................................................................................................31
Processors........................................................................................................................................32
Cell Memory System.......................................................................................................................32
Memory Controller ....................................................................................................................33
DIMM Architecture....................................................................................................................33
Memory Interconnect.................................................................................................................33
Mixing Different Sized DIMMs..................................................................................................34
Memory Interleaving.................................................................................................................34
Memory Bank Attribute Table..............................................................................................34
Cell Map................................................................................................................................35
Table of Contents 3
