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HUAWEI EM820W HSPA+ PC Embedded Module
Hardware Guide Electrical and Reliability Features
Issue 01 (2010-12-31)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
34
Item Test Condition Standard
Low-temperature
working
Temperature: –30±2ºC
Test duration: 24 h
IEC60068
High-temperature
working
Temperature: 75±2ºC
Test duration: 24 h
IEC60068
Damp heat cycling High temperature: 55±2ºC
Low temperature: 25±2ºC
Humidity: 95%
Repetition times: 4
Test duration: 12 h + 12 h
IEC60068
Temperature shock Low temperature: –40±2ºC
High temperature: 85±2ºC
Temperature change interval: < 30s
Test duration: 15 min
Repetition times: 100
IEC60068
Salty fog test Temperature: 35°C
Density of the NaCl solution: 5±1%
Spraying interval: 8 h
Duration of exposing the module to
the temperature of 35°C: 16 h
IEC60068
Sine vibration Frequency range: 5 Hz to 200 Hz
Acceleration: 10 m/s2
Frequency scan rate: 1 oct/min
Test period: 3 axial directions. Five
circles for each axial direction.
IEC60068
Shock test Half-sine wave shock
Peak acceleration: 300 m/s2
Shock duration: 11 ms
Test period: 6 axial directions. One
shock for each axial direction.
IEC60068
Clash test
Half-sine wave
Peak acceleration: 180 m/s2
Pulse duration: 6 ms
Repetition time: 6 directions. 1000
times for each direction.
IEC60068