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Add-on modules / Upgrading
A26361-D1522-Z120-3-6319 English - 17
Mounting heat sink
Be sure to use heat conducting material between the processor and the heat sink. If a heat
conducting pad (rubber-like foil) is already applied to the heat sink, then use it. Otherwise you must
apply a very thin layer of heat conducting paste.
Heat conducting pads can only be used once. If you remove the heat sink, you must clean it and
apply new heat conducting paste before you remount it.
Please note that, depending on the heat sink used, different heat sink mounts are required on the
mainboard.
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If a counter-plate is mounted on the underside of the mainboard for reinforcement, no
heat sinks of the type "Intel Boxed" may be used. Otherwise the retaining clips of the heat
sink will be damaged.
When using an "Intel Boxed" heat sink, the mainboard must be converted. This
conversion set is either included with the mainboard or is available separately.
If no counter-plate is mounted, you can use both "Intel Boxed" heat sinks and standard
heat sinks. If you use the "Intel Boxed" heat sink, the mainboard will bend due to the high
pressure of the retaining clips. This behaviour is specified by Intel.
Ê Depending on the configuration variant, you
must pull a protective foil off the heat sink or
coat the heat sink with heat conducting paste
before fitting it.
Ê Depending on the processor variant, clips
may also be supplied for mounting the heat
sink that fix it in place.
Ê When you have mounted the optional fan,
connect the fan plug to the corresponding
connection on the mainboard.